R50/R54-Series

Sheet Resistance Mapping

Filmetrics R-Series mapping tools marry the sheet resistance technology developed and perfected by KLA for over 45 years with the benchtop instrument technology and user interface refined over the last 20 years by the Filmetrics team.

The 4PP contact four-point probe configuration is recommended for thin metal and ion implant layers, and the non-contact Eddy Current (EC) probe is recommended for thicker metal layers and soft or flexible conductive surfaces. These techniques support a wide range of measurements, including but not limited to the following:

  • Metal film and backside layer thickness measurements
  • Substrate resistivity
  • Sheet resistance
  • Thin film thickness or resistivity
  • Sheet and bulk conductivity

The Filmetrics R50 design is optimized to support a wide range of sample types with extended clearance and automated sample point mapping using rectangular, linear, polar and custom configurations.

The KLA Instruments™ R54-Series systems offers the measurement performance of the R50 inside a light-tight enclosure with additional functionality to support automated X-Y-θ stages for full 200mm or 300mm wafer mapping of semiconductor and compound semiconductor wafers. Learn more →

Models

Model Sensor Type Measurement
Range
Maximum
Map
Diameter
XY Stage
Range
Maximum
Sample
Height
R50-4PP Contact 4PP 1mΩ/sq -
200MΩ/sq
100mm 100mm x
100mm
100mm
R50-EC Non-contact
eddy current
1mΩ/sq -
50Ω/sq
100mm 100mm x
100mm
100mm
R50-200-4PP Contact 4PP 1mΩ/sq -
200MΩ/sq
200mm 200mm
round
100mm
R50-200-EC Non-contact
eddy current
1mΩ/sq -
50Ω/sq
200mm 200mm
round
100mm
R54-200-4PP Contact 4PP 1mΩ/sq -
200MΩ/sq
200mm 200mm x
200mm
15mm
R54-200-EC Non-contact
eddy current
1mΩ/sq -
50Ω/sq
200mm 200mm x
200mm
15mm
R54-300-4PP Contact 4PP 1mΩ/sq -
200MΩ/sq
300mm 300mm
round*
15mm
R54-300-EC Non-contact
eddy current
1mΩ/sq -
50Ω/sq
300mm 300mm
round*
15mm
*Automated X-Y-θ stages

Sheet Resistance and Other Measurement Applications

  • Semiconductor wafer substrates
  • Glass substrates
  • Plastic (flexible) substrates
  • PCB patterned features
  • Solar Cells
  • Flat panel display layers and patterned features
  • Metal foils
  • Conductive rubbers & elastomers

Common Optional Accessories