We offer a full line of instruments that connect to your XP- or Vista-based computer, as well as optional accessories that fill your measurement needs.
Low-Cost Application-Specific Instruments
F10-AR Measures reflectance of ophthalmic lenses and other curved surfaces. Options available for measuring hardcoat thickness and transmittance.
F10-HC Measures hardcoat and anti-fog layer thicknesses and index. Popular in automotive and other industries that hardcoat polycarbonate.
F10-PA Provides hands-free measurement of parylene thickness.
F10-VC Measures reflectance and transmittance simultaneously. Options available for measuring thickness and index. Popular in vacuum coating applications.
General-Purpose Instruments with
Full-Analysis Capabilities
F20 Used in thousands of applications worldwide. Available with a wide range of accessories and wavelength coverage.
F20-XT Optimized for thicker films - up to 0.5mm in some cases.
On-Line Monitoring Instruments
F30 Monitors reflectance, thickness, and deposition rates during MOCVD, sputtering, and other deposition processes.
F37 In-line thin-film measuring instrument with up to seven probe locations supported.
Microscope-Based Instruments
F40 Attaches to your microscope to measure of thickness and index in spots as small as 2.5 um.
F42 Complete 2-D thickness micro-mapping system.
Automated Mapping of Unpatterned Surfaces
F50 Adds automated mapping capabilities to our F20 family of products. Thickness and index can be mapped as fast as two points per second.
F50-XY- Used for mapping when samples are larger than 300mm in diameter.
F60-t Production-ready tabletop mapping system includes on-board reference, notch finding, interlocked cover, and more.
Automated Mapping of Patterned Semiconductors
F80-t Production-ready tabletop patterned-wafer mapping system capable of 15-points in 21 seconds.
F80-c Cassette-to-cassette version of the F80-t. Supports up to 300mm wafers.
F80-a Automated wafer mapping with integrated wafer transfer tool. Supports up to 300mm wafers.
