Product-Wafer Metrology Made Affordable

Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness ImagingTM technology allows Filmetrics to offer easy recipe set up, industry-leading throughput, and all at a mere fraction of the cost of competing metrology tools.

Unlike conventional metrology tools which measure the thickness at a single spot, the F80 quickly generates a thickness image by collecting thousands of thickness readings in the vicinity of the measurement location. This revolutionary innovation results in...

• Ultra-Fast Measurements
• Superior Ease of Use
• More Robust Automation
• Lower Cost than the Competitors

Spectrometer wavelength recalibrations aren’t even necessary on the F80, since it self-calibrates the entire wavelength range of its spectrometer by fitting the reflectance spectrum of an on-board SiO2-on-Si thickness standard.

Configurations available from low-cost, manual load Table Top Systems to BOLTS Integrated Metrology Modules to fully automated Standalone Cassette-to-Cassette Systems

If you are searching for the next generation in thickness metrology, then look no further than the Filmetrics F80. The F80 is the tool CMP, CVD, PVD and Wafer Track Process Engineers have been waiting for.

Request a copy of the F80 datasheet

Thickness Imaging is a Trademark of Filmetrics, Inc.
R&D 100 Award earned for Filmetrics' Thickness Imaging Technology.