Our F80 Thickness Imaging products are used to measure oxide, STI, and metal CMP processes. Dielectric removal rate, remaining dielectric thickness and uniformity, erosion, and residual oxide on STI are common applications. CMP consumable suppliers use the F80-t tabletop system to quickly characterize CMP processes to shorten their slurry and pad development cycle.

Our F40 system is also used in CMP process development, performing dielectric film thickness and erosion measurements.

For semiconductor CMP measurements, contact our thin-film experts.

Filmetrics offers free trial measurements - results are typically available in 1-2 days.